| December 13, 2007
| 2,243 Views
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San Francisco Intel and other companies including Microsoft, Hewlett-Packard, Texas Instruments, NEC and NXP Semiconductors, have formed a group to help produce, test and promote the new USB 3.0.
The third-generation Universal Serial Bus interconnect will transfer data at speeds up to 4.8Gbit/s, ten times faster than the previous USB 2.0’s which transfers at just 480MBit/s.
Faster...