Seagate Debut USB 3.0 At CES
Seagate and Symwave will demonstrate the world's first USB 3.0 at CES from the 8th-11th January, 2009...
Seagate will showcase the world’s first USB 3.0 at this year’s CES in Las Vegas. The new technology, developed in collaboration with Symwave, a semiconductor supplier of connectivity solutions for the PC and mobile devices, promises data transfer speeds of up to 10 times that of existing USB connections.
Seagate USB 3.0
USB 3.0 device, designed to comply with the SuperSpeed (USB 3.0) specification revision 1.0., will transfer data at a maximum of 5GBs per second and is backward compatible with all USB 2.0 devices.
The companies will showcase USB 3.0’s read-and-write speeds using a Seagate FreeAgent external HDD and a Symwave-built USB 3.0 storage controller. The demo will take place in a private suite at the Las Vegas Hilton immediately adjacent to CES being held at the Las Vegas Convention Center (LVCC) held from the 8th -11th of January.
The demonstration comes just 2 months after Symwave announced the worlds first USB 3.0 physical layer device (PHY).
Seagate was selected for this display of technology due to the company’s industry leadership position and reputation for maintaining a high-level of technological innovation, reported Reuters.
Yossi Cohen, president and CEO of Symwave said:
“Symwave is honored to be working with Seagate in this show of the first USB 3.0 solution in a real world application of data backup, storage and media streaming…
“Customer reaction to our new PHY device for USB 3.0 has been extremely positive and we will continue to focus on delivering leading-edge products that will allow them to address the growing demand for high-speed storage solutions.”
The industry’s SuperSpeed USB organization encompasses over 200 companies
including some of the leading brands in consumer electronics, mobile devices, storage,and PCs.
With these driving forces behind the development of USB 3.0, the SuperSpeed USB is almost certain to become the most prominent high speed connectivity technology for the next few years to come.
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